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 Remote Controller MCU
SST65P542R
SST65P542RRemote Controller MCU
Data Sheet
FEATURES:
* 8-bit MCU Core - Enhanced 6502 Microprocessor Megacell emulating the reduced 6805 instruction set * 4 MHz Typical Oscillator Clock Frequency * 8 MHz Maximum Oscillator Clock Frequency * Low Voltage Operation: 2.2-3.2V * 20 Re-configurable General Purpose I/O pins * SuperFlash Memory - 16 KByte of Flash Memory - 128 Byte sectors for SoftPartition - 100,000 endurance cycles (typical) - 100 years data retention - Fast Write: - Chip-Erase: 70 ms (typical) - Sector-Erase: 18 ms (typical) - Byte-Program: 60 s (typical) - In-Application Programming (IAP) * External Host Programming Mode for Programmer Support - JEDEC Standard Command Sets * 352 Byte On-Chip SRAM * In-System Programming (ISP) Support through Firmware * IR Input Pin for Learning Mode * Carrier Modulator Transmitter - Supports Baseband, Pulse Length Modulator (PLM), and Frequency Shift Keying (FSK) * Core Timer / Counter - 14-stage multifunctional ripple counter - Includes timer overflow, POR, RTI, and CWT * External Reset and Low Power Reset Pins - One of these pins should be used to connect the external Power-on/Brown-out reset circuitry * Power Management - Hardware enable bits programmable by software for entering STOP and IDLE modes * Package Available - 28-lead SOIC * All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST65P542R is a member of SST's 8-bit applicationspecific microcontroller family targeted for infrared remote controller applications. The SST65P542R microcontroller provides high functionality to infrared remote controller products. The device offers flexibility to store different remote control configurations for controlling multiple appliances. The configurations are either programmed at the factory during the manufacturing process or downloaded through firmware. Using SST's SuperFlash nonvolatile memory technology, the SST65P542R enhances the functionality and reduces the cost of conventional universal remote controller devices by integrating the multiple functions of a remote controller system in a single chip solution. The built-in LED I/O ports can directly drive LED indicators. The IR transmitter port drives signals to the infrared transmitter, which, in turn, remotely controls the appliances. The SoftPartition architecture allows seamless flash memory partitioning of the program code, protocol tables, and user data in the small granularity of 128 Byte sectors. The small sector size and fast Write capability of the device greatly decreases the time and power when altering the contents of the flash memory. The highly reliable, patented SuperFlash technology provides significant advantages over conventional flash memory technology. These advantages translate into significant cost savings and reliability benefits for customers.
(c)2005 Silicon Storage Technology, Inc. S71170-06-000 7/05 1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. SoftPartition is a trademark of Silicon Storage Technology, Inc. These specifications are subject to change without notice.
Remote Controller MCU SST65P542R
Data Sheet
TABLE OF CONTENTS
PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 LIST OF FIGURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 LIST OF TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.0 FUNCTIONAL BLOCKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.0 PIN ASSIGNMENTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.0 I/O REGISTERS AND MEMORY ORGANIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 SRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3 SuperFlash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.0 PARALLEL INPUT/OUTPUT PORTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.2 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.3 Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.0 FLASH MEMORY PROGRAMMING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1 In-Application Programming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.2 External Host Programming Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.0 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.1 External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.2 External Low Power Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.3 Internal Power-on and Brown-out Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.4 COP Watchdog Timer Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6.5 Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.0 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.1 Software Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.2 External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.3 CMT Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 Core Timer Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8.0 OPERATION MODES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.1 User Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 8.2 Learning Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
2
Remote Controller MCU SST65P542R
Data Sheet 9.0 PERIPHERALS AND OTHERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.1 Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.2 Carrier Modulator Transmitter (CMT). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.3 Clock Input Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.4 Crystal/Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 9.5 External Clock Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 10.0 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 10.1 STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 10.2 IDLE Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 11.0 ELECTRICAL SPECIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 11.1 Absolute Maximum Stress Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 11.2 Reliability Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 11.3 DC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 11.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 11.5 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 12.0 PRODUCT ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 13.0 PACKAGING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
3
Remote Controller MCU SST65P542R
Data Sheet
LIST OF FIGURES
FIGURE 2-1: Pin Assignments for 28-lead SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 FIGURE 3-1: Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 FIGURE 4-1: Port B Interrupt and Pull-Up Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 FIGURE 6-1: Reset Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 FIGURE 9-1: Using the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 FIGURE 9-2: External Clock Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 FIGURE 10-1: Stop Mode and Idle Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 FIGURE 11-1: External Host Programming Mode - Setup Cycle Timing Diagram. . . . . . . . . . . . . . . . . . . . 32 FIGURE 11-2: External Host Programming Mode - Read Cycle Timing Diagram . . . . . . . . . . . . . . . . . . . . 32 FIGURE 11-3: External Host Programming Mode - Write Cycle Timing Diagram . . . . . . . . . . . . . . . . . . . . 33 FIGURE 11-4: External Host Programming Mode - Chip-Erase Timing Diagram . . . . . . . . . . . . . . . . . . . . 33 FIGURE 11-5: External Host Programming Mode Sector-Erase Timing Diagram . . . . . . . . . . . . . . . . . . . . 34 FIGURE 11-6: External Host Programming Mode Byte-Program Timing Diagram . . . . . . . . . . . . . . . . . . . 34 FIGURE 11-7: AC Input/Output Reference Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 FIGURE 11-8: A Test Load Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 FIGURE 11-9: Byte-Program Command Sequence for External Host Programming Mode . . . . . . . . . . . . 36 FIGURE 11-10: Wait Options for External Host Programming Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 FIGURE 11-11: Chip-/Sector-Erase Command Sequence for External Host Programming Mode . . . . . . . 38
LIST OF TABLES
TABLE 2-1: Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 TABLE 3-1: Register Descriptions and Bit Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 TABLE 3-5: Interrupt/Reset Sector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 TABLE 5-1: SFFR Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 TABLE 5-2: External Host Programming Mode Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 TABLE 5-3: External Host Programming Mode Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 TABLE 5-4: Software Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 TABLE 8-1: Pin Assignment For Different Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 TABLE 11-1: Reliability Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 TABLE 11-2: Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 TABLE 11-3: DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 TABLE 11-4: Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 TABLE 11-5: External Host Programming-Mode Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 TABLE 13-1: Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
4
Remote Controller MCU SST65P542R
Data Sheet
1.0 FUNCTIONAL BLOCKS
FUNCTIONAL BLOCK DIAGRAM
MCU Core SuperFlash Memory 16K x8 Port A IRO Carrier Modulator Transmitter Port B Port C
Interrupt Control
IRQ#
RAM 352K x8
Timer/Counter Interrupt Real-Time Counter Core Timer / Counter COP Watchdog Timer
1170 B1.8
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
5
Remote Controller MCU SST65P542R
Data Sheet
2.0 PIN ASSIGNMENTS
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-lead SOIC Top View
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1170 28-soic P01.5
OSC1 OSC2 VDD IRQ# RST# IRO VSS LPRST# PC3 PC2 PC1 PC0 PA7 PA6
FIGURE
2-1: PIN ASSIGNMENTS FOR 28-LEAD SOIC
2.1 Pin Descriptions
TABLE
Symbol PA[7:0] PB[7:0] PC[3:0] IRO LPRST#
2-1: PIN DESCRIPTIONS
Type I/O1 I/O I/O O I Name and Functions Port A: The state of any pin in Port A is software programmable and every line is configured as an input during any reset. Port B: The state of any pin in Port B is software programmable and every line is configured as an input during any reset. Each I/O line contains a programmable interrupt/pull-up for keyscan. Port C: Every pin in Port C is a high-current pin and its state is software programmable. All lines are configured as inputs during any reset. IRO: Suitable for driving IR LED biasing logic, the IRO pin is the high-current source and sink output of the carrier modulator transmitter subsystem. Default state is low after any reset. Low-Power Reset: An active-low pin, LPRST# function sets MCU to low-power reset mode. Once the device is in low-power reset mode, it is held in reset with all processor clocks and crystal oscillator halted. An internal Schmitt trigger is included in the LPRST# pin to improve noise immunity. Reset: By setting the RST# pin low, the device is reset to a default state. An internal Schmitt trigger is included in the RST# pin to improve noise immunity. Oscillator 1,2: These 2 pins interface with external oscillator circuits. A crystal resonator, a ceramic resonator, or an external clock signal can be used. Interrupt Request: The IRQ# is negative edge-sensitive triggered. An internal Schmitt trigger is included in the IRQ# pin to improve noise immunity. Power Supply: Supply Voltage (2.2-3.2V) Ground: Circuit ground. (0V reference)
T2-1.14 1170
RST# OSC1 OSC2 IRQ# VDD VSS
I I O I PWR PWR
1. I = Input, O = Output
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
6
Remote Controller MCU SST65P542R
Data Sheet
3.0 I/O REGISTERS AND MEMORY ORGANIZATION
The SST65P542R has a total of 64 KByte of addressable memory space. A memory map is located in Figure 3-1. The on-chip memory consists of 32 Bytes of I/O registers, 352 Bytes of SRAM, 16 KByte of user flash memory and 128 Bytes of user vectors.
0180H Reserved 3FEFH CWT Reset 3FF0H 3FF1H Reserved 352 Bytes SRAM I/O Registers
0000H 001FH 0020H
017FH 0180H
BFFFH C000H BFFFH User Memory 127 Sectors (128 Bytes per sector)
Flash Memory (128 sectors)
16,256 Bytes
FFF6H Core Timer Vector - (High Byte) FFF7H FFF8H FFF9H FFFAH FFFBH FFFCH FFFDH FFFEH FFFFH Core Timer Vector - (Low Byte) CMT Vector (High Byte) CMT Vector (Low Byte) IRQ/Port B Vector (High Byte) IRQ/Port B Vector (Low Byte) SWI Vector (High Byte) SWI Vector (Low Byte) Reset Vector (High Byte) Reset Vector (Low Byte)
Flash Memory Read Protection
FF80H FF81H
FF7FH FF80H User Vector FFFFH
Reserved FFF5H FFF6H
Reset and Interrupt Vectors
FFFFH
1170 F02.9
FIGURE
3-1: MEMORY MAP
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
7
Remote Controller MCU SST65P542R
Data Sheet
3.1 I/O Registers
The 32 Bytes of I/O registers occupy address locations from 0000H to 001FH that include general purpose I/O registers, the SuperFlash Function Register, and on-chip peripheral control registers. TABLE
Symbol1 PORTA PORTB PORTC DDRA
3-1: REGISTER DESCRIPTIONS AND BIT DEFINITIONS (1 OF 2)
Description Port A Data Register Port B Data Register Port C Data Register Reserved Port A Data Direction Register Port B Data Direction Register Port C Data Direction Register Reserved Core Timer Control and Status Register Core Timer Counter Register Port B Interrupt Control Register SuperFlash Function Register Port B Pull-up Control Register CWT Control Register Reserved Reserved Carrier Generator High Data Register 1 Carrier Generator Low Data Register 1 Carrier Generator High Data Register 2 Direct Address 0000H 0001H 0002H 0003H 0004H Bit Address, Bit Symbol Bit 7 PA7 PB7 DDRA7 Bit 6 PA6 PB6 DDRA6 Bit 5 PA5 PB5 DDRA5 Bit 4 PA4 PB4 DDRA4 Bit 3 PA3 PB3 PC3 DDRA3 Bit 2 PA2 PB2 PC2 DDRA2 Bit 1 PA1 PB1 PC1 DDRA1 Bit 0 PA0 PB0 PC0 DDRA0 Reset Value2,3 00H 00H 00H 00H
DDRB
0005H
DDRB7
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
00H
DDRC
0006H
-
-
-
-
DDRC3
DDRC2
DDRC1
DDRC0
00H
CTSCR
0007H 0008H
CTOF
RTIF
TOFE
RTIE
TOFC
RTFC
RT1
RT0
03H
CTCR
0009H
CTD7
CTD6
CTD5
CTD4
CTD3
CTD2
CTD1
CTD0
00H
PBIC
000AH
INPRB7
INPRB6
INPRB5
INPRB4
INPRB3
INPRB2
INPRB1
INPRB0
00H
SFFR
000BH
PREN
MEREN
SEREN
-
PROG
MERA
SERA
-
00H
PBPUC
000CH
-
-
-
-
-
-
PU1
PU0
03H
CWTC CHR1
000DH 000EH 000FH 0010H
IROLN
CMTPOL
PH5
PH4
PH3
PH2
PH1
CWT_EN PH0
00000001b 00UUUUUUb
CLR1
0011H
IROLP
-
PL5
PL4
PL3
PL2
PL1
PL0
00UUUUUUb
CHR2
0012H
-
-
SH5
SH4
SH3
SH2
SH1
SH0
00UUUUUUb
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
8
Remote Controller MCU SST65P542R
Data Sheet TABLE
Symbol1 CLR2
3-1: REGISTER DESCRIPTIONS AND BIT DEFINITIONS (CONTINUED) (2 OF 2)
Description Carrier Generator Low Data Register 2 Modulator Control and Status Register Modulator Data Register 1 Modulator Data Register 2 Modulator Data Register 3 Power Saving Control Register Reserved Reserved Reserved Reserved Reserved Reserved Reserved COP Watchdog Timer Reset Register Direct Address 0013H Bit Address, Bit Symbol Bit 7 Bit 6 Bit 5 SL5 Bit 4 SL4 Bit 3 SL3 Bit 2 SL2 Bit 1 SL1 Bit 0 SL0 Reset Value2,3 00UUUUUUb
MCSR
0014H
EOC
DIV2
EIMSK
EXSPC
BASE
MODE
EOCIE
MCGEN
00H
MDR1
0015H
MB11
MB10
MB9
MB8
SB11
SB10
SB9
SB8
UUUUUUUUb
MDR2
0016H
MB7
MB6
MB5
MB4
MB3
MB2
MB1
MB0
UUUUUUUUb
MDR3
0017H
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
UUUUUUUUb
PSCR
0018H
EN
-
-
-
-
-
STOP
IDL
10000011b
CWTC
0019H 001AH 001BH 001CH 001DH 001EH 001FH 3FF0H
-
-
-
-
-
-
-
CWT_CLR
01H
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1. "-" = reserved bits 2. "U" = unaffected by any reset 3. These registers can be reset by either external or internal reset.
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Data Sheet PORT A Data Register (PORTA)
Location 0000H 7 PA7 6 PA6 5 PA5 4 PA4 3 PA3 2 PA2 1 PA1 0 PA0 Reset Value 00H
Symbol PA[7:0]
Function Port A data register bit 0 to 7. These bits are for both reading and writing. Write the data to this register will output data to port A pins when it's in output mode. If the pins are set to input mode, only the output data register is updated, port A pins are tri-stated. Reading the data from this register will read the state of port A pins when set in input mode. If the pins are set to output mode, it reads the output data register. See Table 3-2 for details. For a detailed explanation of each parallel I/O port, please refer to Section 4.0, "Parallel Input/Output Ports" on page 20.
PORT B Data Register (PORTB)
Location 0001H 7 PB7 6 PB6 5 PB5 4 PB4 3 PB3 2 PB2 1 PB1 0 PB0 Reset Value 00H
Symbol PB[7:0]
Function Port B data register bit 0 to 7. These bits are for both reading and writing. Writing data to this register will output data to port B pins when it's in output mode. If the pins are set to input mode, only the output data register is updated, port B pins are tri-stated. Reading the data from this register will read the state of port B pins when set in input mode. If the pins are set to output mode, it reads the output data register. See Table 3-2 for details.
PORT C Data Register (PORTC)
Location 0003H 7 6 5 4 3 DDRC3 2 DDRC2 1 DDRC1 0 DDRC0 Reset Value 00H
Symbol PC[3:0]
Function Port C data register bit 0 to 3. These bits are for both reading and writing. Writing data to this register will output data to port C pins when it's in output mode. If the pins are set to input mode, only output data register is updated, port C pins are tri-stated. Reading data from this register will read the state of port C pins when set in input mode. If the pins are set to output mode, it reads the output data register. See Table 3-2 for details. 3-2: I/O PIN FUNCTIONS AS GENERAL PURPOSE I/O
DDRA, DDRB, DDRC 0 1 0 1 Mode Input Output Input Output I/O Pin Functions Data is written into the output data register. Data is written into the output data register and output to the I/O pins. The state of I/O is read The output data register is read
T3-2.0 1170
TABLE
Access Write Write Read Read
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Data Sheet PORT A Data Direction Register (DDRA)
Location 0004H 7 DDRA7 6 DDRA6 5 DDRA5 4 DDRA4 3 DDRA3 2 DDRA2 1 DDRA1 0 DDRA0 Reset Value 00H
Symbol DDRA[7:0]
Function Port A data direction register bit 0 to 7. These bits are for both reading and writing. See Table 3-2 for details. 0: Port A is input 1: Port A is output
PORT B Data Direction Register (DDRB)
Location 0005H 7 DDRB7 6 DDRB6 5 DDRB5 4 DDRB4 3 DDRB3 2 DDRB2 1 DDRB1 0 DDRB0 Reset Value 00H
Symbol DDRB[7:0]
Function Port B data direction register bit 0 to 7. These bits are for both reading and writing. See Table 3-2 for details. 0: Port B is input 1: Port B is output
PORT C Data Direction Register (DDRC)
Location 0006H 7 6 5 4 3 PC3 2 PC2 1 PC1 0 PC0 Reset Value 00H
Symbol DDRC[3:0]
Function Port C data direction register bit 0 to 3. These bits are for both reading and writing. See Table 3-2 for details. 0: Port C is input 1: Port C is output
PORT B Interrupt Control Register (PBIC)
Location 000AH 7 INPRB7 6 INPRB6 5 INPRB5 4 INPRB4 3 INPRB3 2 INPRB2 1 INPRB1 0 INPRB0 Reset Value 00H
Symbol INPRB[7:0]
Function Port B interrupt control bits 0: Interrupt is enabled 1: Interrupt is disabled
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Data Sheet PORT B Pull-up Control Register (PBPUC)
Location 000CH 7 6 5 4 3 2 1 PU1 0 PU0 Reset Value 03H
Symbol PU1,PU0
Function Port B pull-up control bits. The following table shows pull-up strength. Defaults to strong pull-up when reset. 3-3: PULL-UP CONTROL BIT DESCRIPTION
PU0 0 1 0 1 Pull-up No pull-up for Port B bit Weak pull-up for each Port B bit Weak pull-up for each Port B bit Strong pull-up for each Port B bit1
T3-3.1 1170
TABLE
PU1 0 0 1 1
1. Default value after Power-on or Reset
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Data Sheet Core Timer Control Status Register (CTCSR)
Location 0008H 7 CTOF 6 RTIF 5 TOFE 4 RTIE 3 TOFC 2 RTFC 1 RT1 0 RT0 Reset Value 03H
Symbol CTOF
Function Core timer overflow bit. CTOF is a real-only status bit, this bit is set when the 8-bit ripple counter rolls over from FFH to 00H. Writing to this bit has not effect. Reset clears CTOF. CTOF set to zero by writing a one to TOFC. Real-time Interrupt bit. RTIF is a read-only status bit. Writing has no effect on this bit. Reset clears RTIF. The real time interrupt circuit consists of a divider and a one-of-four selector. The input clock frequency that drives the RTI circuit is E/212 with three additional divider stages that allows a maximum interrupt period of 16 ms at the internal peripheral clock rate of 2.048 MHz. 0: Writing a one to RTFC clears the RTIF. 1: When the output of the chosen (one-of-four selector) stage goes active.
RTIF
TOFE
Timer overflow enable bit. TOFE is statuses bit for both read and write. Reset clears this bit. 0: If the CTOF is not set or no timer overflow occurs. 1: If the CTOF is set and a CPU interrupt request is generated
RTIE
Real time interrupt enable bit. RTIE is a status bit for both read and write. Reset clears this bit. 0: If the RTIF is not set. 1: If the RTIF is set and a CPU interrupt request is generated.
TOFC
Timer overflow flag clear bit. This bit is for writing only. 0: Writing a zero has no effect on the CTOF bit. This bit always reads as zero. 1: When a one is written to this bit, CTOF is cleared.
RTFC
Real time interrupt flag clear bit. This bit is for writing only. 0: Writing a zero has no effect on the RTIF bit. This bit always reads as zero. 1: When a one is written to this bit, RTIF is cleared.
RT[1:0]
Real time interrupt rate select bit. These two bits select one of four taps from the interrupt logic. See Table 3-4. Reset sets these two bits, which selects the lowest periodic rate and gives the maximum. Care should be taken when altering RT0 and RT1 if the timeout period is imminent or uncertain. The CWT should be cleared before changing RTI taps. If the selected tap is modified during a cycle in which the counter is switching, an RTIF could be missed or an additional one could be generated. 3-4: RTI AND CWT RATES AT 4.096 MHZ OSCILLATOR, PRESCALER=1
RTI Rate RT1-RT0 212/E1 213/E 214/E 215/E 00 01 10 11 Minimum CWT Rates (215-212)/E (216-213)/E (217-214)/E (218-215)/E 14ms 28ms 56ms 112ms Maximum CWT Rates (215)/E (216)/E (217)/E (218)/E 16ms 32ms 64ms 128ms
T3-4.2 1170
TABLE
2ms 4ms 8ms 16ms
1. E is the internal peripheral clock frequency and E = FOSC/2
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Data Sheet Core Timer Counter Register (CTCR)
Location 0009H 7 CTD7 6 CTD6 5 CTD5 4 CTD4 3 CTD3 2 CTD2 1 CTD1 0 CTD0 Reset Value 00H
Symbol CTD[7:0]
Function The core timer counter register bit 0 to bit 7. This is a read only status register in which contains the current value of the 8-bit ripple counter. This counter is clocked by the CPU clock (E/4) and can be used for various functions, including a software input capture. Extended time can be achieved by using the timer overflow function to increment a variable to simulate a 16-bit counter.
SuperFlash Function Register (SFFR)
Location 000BH 7 PREN 6 MEREN 5 SEREN 4 3 PROG 2 MERA 1 SERA 0 Reset Value 00H
Symbol PREN
Function Byte program enable bit. 0: Disable the byte program. 1: Enable the byte program.
MEREN
Mass (chip) program enable. 0: Disable the mass (chip) erase or program. 1: Enable the mass (chip) erase or program.
SEREN
Sector program enable. 0: Disable the sector erase or program. 1: Enable the sector erase or program.
PROG
Byte program control bit. 0: Not performs the byte program 1: Performs the byte program.
MERA
Mass (chip) program active bit. 0: Not performs the chip program 1: Performs the chip program.
SERA
Sector program active bit. 0: Not performs the sector program. 1: Performs the sector program.
Therefore, when SFFR=22H, the MCU will perform the Sector-Erase, SFFR=44H, the MCU will perform the ChipErase, and SFFR=88H, the MCU will perform the Byte-Program. For a detailed explanation of MCU flash control, please refer to Section 5.1, "In-Application Programming" on page 21.
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Data Sheet COP Watchdog Timer Control Register (CWTC)
Location 000DH 7 6 5 4 3 2 1 0 CWT_EN Reset Value 01H
Symbol CWT_EN
Function COP watchdog timer enable bit. 0: COP watchdog timer is enabled. 1: COP watchdog timer is disabled.
COP Watchdog Timer Reset Register (CWTR)
Location 3FF0H 7 6 5 4 3 2 1 0
CWT_CLR
Reset Value 01H
Symbol CWT_CLR
Function This bit is for writing only. For detail explanation of COP Watchdog Timer Reset, please refer to Section 6.4 0: Write zero to this bit will clear COP watchdog timer. 1: Write one to this bit has no effect. Read this bit will always returns one.
Carrier Generator High Data Register1 (CHR1)
Location 0010H 7 IROLN 6 CMTPOL 5 PH5 4 PH4 3 PH3 2 PH2 1 PH1 0 PH0 Reset Value 00UUUUUUb
Symbol IROLN
Function IRO latch control bit. Reading IROLN bit reads the state of the IRO latch. Writing IROLN updates the IRO latch with the data being written on the negative edge of the internal processor clock (FOSC/2). The IRO latch is clear out of reset. Writing to CHR1 to update IROLN will also update the primary carrier high data value. In addition, writing to CHR1 to update IROLN will update the CMT polarity bit. Bit 6 should contain the data of CMTPOL polarity bit. CMT output polarity bit. This bit controls the polarity of the CMT output (IRO). 0: the CMT output is active high. 1: the CMT output is active low.
CMTPOL
PH[5:0]
Primary carrier high time data values. When selected, these bits contain the number of input clocks required to generate the carrier high time periods. When operating in timer mode, CHR1 and CLR1 are always selected. When operating in FSK mode, CHR1, CLR1 and CHR2, CLR2 are alternately selected under control of the modulator. The primary carrier high and low time values are undefined on the reset. These bits must be written to non-zero values that before the carrier generator is enabled to avoid spurious results.
Bit 0 to Bit 7 of CHR1 can be used for both reading and writing. Note:"U" indicates that the bit is unaffected after reset.
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Remote Controller MCU SST65P542R
Data Sheet Carrier Generator Low Data Register1 (CLR1)
Location 0011H 7 IROLP 6 5 PL5 4 PL4 3 PL3 2 PL2 1 PL1 0 PL0 Reset Value 00UUUUUUb
Symbol IROLP
Function IRO latch control bit. Reading IROLP bit reads the state of the IRO latch. Writing IROLP updates the IRO latch with the data being written on the negative edge of the internal processor clock (FOSC/2). Writing to CLR1 to update IROLP will also update the primary carrier low data value. Care should be taken that bits 5-0 of the data to be written to CHR1 or CLR1. Primary carrier low time data values. The function of these bits is the same as PH[5:0].
PL[5:0]
Carrier Generator High Data Register2 (CHR2)
Location 0012H 7 6 5 SH5 4 SH4 3 SH3 2 SH2 1 SH1 0 SH0 Reset Value 00UUUUUUb
Symbol SH[5:0]
Function Secondary carrier high time data values. When selected, these bits contain the number of input clocks required to generate the carrier high time periods. When operating in time mode, CHR2 and CLR2 is never selected. When operating in FSK mode, CHR2, CLR2 and CHR1, CLR1 are alternately selected under control of the modulator. The secondary carrier high and low time values are undefined on the reset. These bits must be written to nonzero values before the carrier generator is enabled when operating in FSK mode.
Carrier Generator Low Data Register2 (CLR2)
Location 0013H 7 6 5 SL5 4 SL4 3 SL3 2 SL2 1 SL1 0 SL0 Reset Value 00UUUUUUb
Symbol SL[5:0]
Function Secondary carrier low time data values. The function of these bits is the same as SH[5:0].
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Data Sheet Modulator Control and Status Register (MCSR)
Location 0014H 7 EOC 6 DIV2 5 EIMSK 4 EXSPC 3 BASE 2 MODE 1 EOCIE 0 MCGEN Reset Value 00H
Symbol EOC
Function End of modulation cycle status bit. This bit is read only. EOC is set when a match occurs between the contents of the space period register SREG and the down counter. At the end of cycle, the counter is initialized with the contents of the mark period buffer, MBUFF and SREG is loaded with the space period buffer SBUFF. This flag is cleared by reading the MCSR followed by an access of MDR2 or MDR3. EOC is cleared by reset. 0: current modulation cycle in progress. 1: end of modulator cycle has occurred. Divide by two scaler bit. The divide-by-two prescaler causes the CMT to be clocked at the bus rate, when the two times of bus rate is enabled and the FOSC is disabled. Since this bit is not double buffered, this bit should not be set during a transmission. 0: divide-by-two prescaler disabled. 1: divide-by-two prescaler enabled. External Interrupt Mask bit. This bit is used to mask IRQ and keyscan interrupts. This bit is cleared by reset. 0: IRQ and keyscan interrupts enabled. 1: IRQ and keyscan interrupts disabled. Extended Space Enable bit. For detailed description of extended space operation, please refer to 65P542R Programming User's Manual. 0: Extended space disabled. 1: Extended space enabled Baseband Enable bit. This bit disables the carrier generator and forces the carrier output high for generation of baseband protocols. When BASE is cleared, the carrier generator is enabled and the carrier output toggles at the frequency determined by values stored in the carrier data registers. This bit is cleared by reset. This bit is not double buffered and should not be written during a transmission. 0: Baseband disabled. 1: Baseband enabled. Mode select bit. This bit is cleared by reset. This bit is not double buffered and should not be written during a transmission. 0: CMT operates in Time mode. 1: CMT operates in FSK mode. Interrupt enable bit. Interrupt request will be generated when EOC is set and EOCIE is set. Otherwise, interrupt will not be generated 0: interrupt disabled. 1: interrupt enabled. Modulator and carrier generator enable bit. Set this bit will initialize the carrier and modulator and will enable all clocks. Once enabled, the carrier generator and modulator will function continuously. 0: if this bit is zero, the current modulator cycle will be allowed to expire before all carrier and modulator clocks are disabled and the modulator output is forced low. To prevent spurious operation, the user should initialize all data and control registers before enabling the system. This bit is cleared by reset. All bits except Bit 0 can be used for both reading and writing. 1: Modulator and carrier generator enabled.
DIV2
EIMSK
EXSPC
BASE
MODE
EOCIE
MCGEN
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Remote Controller MCU SST65P542R
Data Sheet Modulator Data Register 1 (MDR1)
Location 0015H 7 MB11 6 MB10 5 MB9 4 MB8 3 SB11 2 SB10 1 SB9 0 SB8 Reset Value UUUUUUUUb
Symbol MB[11:8] SB[11:8]
Function MBUFF high 4 bits. SBUFF high 4 bits.
These bits can be used for both reading and writing. Modulator Data Register 2 (MDR2)
Location 0016H 7 MB7 6 MB6 5 MB5 4 MB4 3 MB3 2 MB2 1 MB1 0 MB0 Reset Value UUUUUUUUb
Symbol MB[7:0]
Function MBUFF lower 8 bits. These bits can be used for both reading and writing.
Modulator Data Register 3 (MDR3)
Location 0016H 7 SB7 6 SB6 5 SB5 4 SB4 3 SB3 2 SB2 1 SB1 0 SB0 Reset Value UUUUUUUUb
Symbol SB[7:0]
Function SBUFF lower 8 bits. The bits can be used for reading and writing.
Power Saving Control Register (PSCR)
Location 0018H 7 EN 6 5 4 3 2 1 STOP 0 IDL Reset Value 10000011b
Symbol EN
Function This bit enable or disable MCU to stop and idle mode. This bit can be used for both reading and writing. 0: STOP and IDLE mode enable 1: STOP and IDLE mode disable.
STOP
Stop mode enable bit 0: write 0 to this bit will make the device entering the stop mode if EN=0 1: write 1 to this bit has no effect. Read returns one.
IDL
Idle mode enable bit 0: write 0 to this bit will make the device entering the idle mode if EN=0 1: write 1 to this bit has no effect. Read returns one.
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Data Sheet
3.2 SRAM
There are 352 Bytes of SRAM available. The SRAM addresses start from location 0020H to 017FH. The stack pointer can address 64 Bytes of stack beginning at address location 00FFH and ending at 00C0H.
TABLE
3-5: INTERRUPT/RESET SECTOR
User Vectors Flash Memory Read Protection Unused Core Timer Vector - (High Byte) Core Timer Vector - (Low Byte) CMT Vector (High Byte) CMT Vector (Low Byte) IRQ/Port B Vector (High Byte) IRQ/Port B Vector (Low Byte) SWI Vector (High Byte) SWI Vector (Low Byte) Reset Vector (High Byte) Reset Vector (Low Byte)
T3-5.5 1170
Address Location FF80H FF81H-FFF5H FFF6H FFF7H FFF8H FFF9H FFFAH FFFBH FFFCH FFFDH FFFEH FFFFH
3.3 SuperFlash Memory
The SST65P542R has 16 KByte of SuperFlash EEPROM memory. The memory is organized as 128 sectors of 128 Bytes each. The minimum erasable memory unit is one sector or 128 Bytes. The user programmable flash memory occupies the address space from C000H to FF7FH. The user vector area consists of 128 Bytes starting from address location FF80H to FFFFH. Address FF80H is for flash memory read protection. There are five predetermined user vectors from FFF6H through FFFFH dedicated to the reset and interrupts. Every vector consists of two bytes to be loaded into program counter for jumping to an interrupt service routine (ISR). See Table 3-5 for detailed descriptions of these vectors.
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Data Sheet
4.0 PARALLEL INPUT/OUTPUT PORTS 4.1 Port A
Port A consists of eight individual pins driven by one data register and one direction register to control the usage of these pins as either inputs or outputs. All Port A pins are set to Input mode during any Reset. Software must set the right direction register first before performing any Read or Write operation. Any Read operation to the port that was set as output will read back the data from an internal latch register instead of the I/O pins. For details, please refer to Section 3.1 Port A data register and Port A data direction register.
4.2 Port B
Port B pins are similar to Port A pins except that each of the Port B pins has a programmable interrupt generation option which can be enabled for any Port B pins. Port B pins have optional programmable pull-ups. There is a choice between pull-up strengths which could be selected by PU0 or PU1. For details, please refer to Section 3.1, Port B Interrupt Control Register and Port B Pull-up Control Register.
VDD
WEAK0
PU0
WEAK1
PU1 INPRB7 DDRB7
PB7 From all other Port B Pins
. . .
Interrupt Logic
1170 F03.3
FIGURE
4-1: PORT B INTERRUPT AND PULL-UP OPTIONS
4.3 Port C
Port C is a 4-bit bi-directional port (PC3-PC0). Every Port C pin has high current driving capability. Reset clears the Port C Data Register and the data direction register, thereby returning the ports to inputs. For details, please refer to Section 3.1 Port C data register and Port C data direction register.
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Data Sheet
5.0 FLASH MEMORY PROGRAMMING 5.1 In-Application Programming
SST65P542R allows "In-Application Programming" (IAP) to update the user code in the internal 16 Kbyte SuperFlash memory. All Write/Erase operations require setting the enable bit in the SuperFlash Function Register (SFFR) located at 000BH. The following sections describe the operations that the MCU performs to alter the contents of SuperFlash Memory. For detailed explanation of the SuperFlash Function Register, please refer to Section 3.1. 5.1.1 Chip-Erase The Chip-Erase operation requires MEREN and MERA bits to be set to logical "1". After setting these bits, writing any data to any address location of the flash memory will trigger the Chip-Erase operation. The MCU is idle while SST65P542R is busy doing erases on all memory locations. 5.1.2 Sector-Erase The Sector-Erase operation requires SEREN and SERA bits to be set to logical "1". After setting these bits, writing any data to the address within the sector to be erased will erase the data in the sector. The MCU is idle while SST65P542R is busy doing erase on the sector. 5.1.3 Byte-Program The Byte-Program operation requires PREN and PROG bits to be set to logical "1". After setting these bits, and then writing the data to the target address to be programmed. The MCU is idle while SST65P542R is busy doing programming on the byte. Refer to the following summary for all different functions.
.
5.2 External Host Programming Mode
The external host programming mode is to provide programmer access to the 16KB embedded flash memory of the SST65P542R. To enter the external host programming mode, users must follow the setup sequences on the pins (See Figure 11-1): 1. RY/BY# (pin 12) and POROUT# (pin 13) are output pins. Do not drive. 2. Drive RST# (pin 24) low. 3. Drive LPRST# (pin 21) low. 4. Drive LPRST# (pin 21) high after TRST. 5. Drive PROG_RST (pin 9) low. 6. Drive 9 clocks on TCLKIN. On each clock's rising edge provide one bit of data on TDIN (pin 19) as shown in Figure 11-1. The data bits are "11010011". 7. Wait for RY/BY# (pin 12) and POROUT# to go high. 8. Drive at least 24 clocks on TCLKIN. 9. If Read-protect byte is set, then RY/BY# will go low. Otherwise, RY/BY# will stay high. If RY/BY# is low, wait for RY/BY# (pin 12) to go high. Now the SST65P542R is in external host programming mode and is ready for embedded flash Read or Write operations. Now the SST65P542R is in the external host programming mode and is ready for embedded flash by the external host Read or Write. As soon as the RST# is released to `1', chip exits external host programming mode and then enters user mode. 5.2.1 External Host Mode Read Operation As shown in Figure 11-2, the Read operation needs two address setup cycles and one data setup cycle. The low to high transition on SCLK latches the high order address A[13:8] from the pin AD[5:0] while MODE[1:0] inputs are set to 0H; the low to high transition on SCLK latches the low order address A[7:0] from the pin AD[7:0] while the MODE[1:0] inputs are set to 3H and setting the signal OE# to low; the low to high transition on SCLK latches the data D[7:0] on the pin AD[7:0] while the MODE[1:0] is set to 1H for reading. After reading the data, the external host should set the signal OE# to high.
TABLE
5-1: SFFR COMMANDS
Command Writes to SFFR Comment 44H 22H 88H Erase the whole flash memory Erase the sector addressed by CXXXH Program one data byte to address CXXXH. Write data to CXXXH before Byte-Program can be performed, a Chip-Erase or Sector-Erase must be issued to erase the target programming locations.
T5-1.1 1170
Function Chip-Erase Sector-Erase Byte-Program
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Data Sheet 5.2.2 External Host Mode Write Operation As shown in Figure 11-3, the Write operation needs two address setup cycles and one data setup cycle. The low to high transition on SCLK latches the high order address A[13:8] from the pin AD[5:0] while the MODE[1:0] inputs are set to 0H; the low to high transition on SCLK latches the TABLE
Pins 8-1 10,20 11 9 13 12 17 18 21 19 23 22 26
low order address A[7:0] from the pin AD[7:0] while MODE[1:0] inputs are set to 2H; the low to high transition on SCLK latches the data D[0:7] from the pin AD[7:0] while the MODE[1:0] is set to 1H for writing. However, the actual Write operation to embedded flash memory occurs on the rising edge of WE#.
5-2: EXTERNAL HOST PROGRAMMING MODE PIN DESCRIPTIONS
Symbol AD[7:0] MODE[1:0] SLCK PROG_RST POROUT# RY/BY# WE# OE# LPRST# TDIN TCLKIN VSS VDD Type1 I/O1 I I I O O I I I I I PWR PWR Name and Functions Embedded flash memory address and data bus multiplex on AD[7:0] by selecting MODE[1:0] Address and data bus selection bits in the external host programming mode Clock for latch address and data after entering the external host programming mode Reset signal for the external host programming mode Embedded flash memory power-on reset output Embedded flash Ready/Busy output. High is ready Write Enable: embedded flash memory data write enable, low active Output Enable: embedded flash memory data out enable, low active Signal for entering the external host programming mode Data input for entering the external host programming mode This clock will latch TDIN for entering the external host programming mode Ground: Circuit ground (0V reference) Power Supply: Supply voltage (3.2V)
T5-2.3 1170
1. I = Input; O = Output
5.2.3 External Host Mode Byte-Program Operation This device is programmed on a byte by byte basis. The Byte-Program operation consists of three steps. The first step is the three-byte load sequence for Software Data Protection. The second step is to load the byte address and the byte data. The third step is the internal Program operation which is initiated after the rising edge of the fourth WE#. The end of the Byte-Program operation can be determined by using the RY/BY#. Any commands written during the Byte-Program operation will be ignored. See Table 5-4 for the software command sequence, Figure 11-5 for the flash Byte-Program timing diagram, and Figure 11-9 for the Byte-Program command sequence flowchart. 5.2.4 External Host Mode Chip-Erase Operation. The device provides a Chip-Erase operation, which allows the user to erase the entire memory array to the '1's state. This is useful when the device must be quickly erased entirely. The Chip-Erase operation is initiated by executing a six-byte Software Data Protection command sequence, the last byte Sequence is the address 1555H with the ChipErase command 10H. The Chip-Erase operation begins with of the sixth write enable's (WE#) rising edge. The end of the Chip-Erase can be determined by using the signal RY/BY#. Any commands written during the Chip-Erase
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operation will be ignored. See Table 5-4 for the software command sequence, Figure 11-4 for the flash Chip-Erase timing diagram, and Figure 11-11 for the Chip-Erase command sequence flowchart. 5.2.5 External Host Mode Sector-Erase Operation The Sector-Erase operation allows the system to erase the device on a sector-by-sector basis. The sector architecture is based on uniform sector size of 128 Bytes. The SectorErase operation is initiated by executing a six-byte command sequence for Software Data Protection, the last byte sequence is the sector address SA with the Sector-Erase command 30H. The address lines A[13:7] will be used to determine the sector address. The internal Erase operation begins after the sixth write enable's (WE#) rising edge. The End-of-Erase can be determined by using the signal RY/ BY#. Any commands written during the Sector-Erase operation will be ignored. See Table 5-4 for the software command sequence, Figure 11-5 for the flash Sector-Erase timing diagram, and Figure 11-11 for the Sector-Erase command sequence flowchart.
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Data Sheet 5.2.6 Operation Status Detection - Program Timer Method During the Program or Erase operation, the programmer can use the timer to decide the completion of the operation. When a Program or Erase operation is started, system setup a timer for TBP (for Byte-Program), TSCE (for ChipErase), and TSE (for Sector-Erase) time period. After this timer time-out, the operation is completed. See Figure 1110 for Program Timer flowchart. 5.2.7 Operation Status Detection - RY/BY# Method During the internal Program or Erase operation, the signal RY/BY# indicates the status of the operation. When the internal Program or Erase operation is in progress, the signal RY/BY# will be driven low. When the internal Program or Erase operation is completed, the signal RY/BY# will be driven high. The device is then ready for the next operation. See Figure 11-10 for the Program Timer flowchart. 5.2.8 Exiting The External Host Programming Mode To exit the external host programming mode, the external host must set the RST# pin to high, and the PROG_RST is reset to high. The device will exit the host programming and enter the user mode. The MCU starts execution codes out of the User Memory Space from the reset vector. TABLE 5.2.9 Flash Read Protection To protect the program code from piracy the flash memory location 3F80H (user memory address FF80H, flash memory is mapped to C000H through FFFFH, see Figure 3-1) is evaluated by the internal hardware to determine the read protect mode state. During this evaluation period, only the RY/BY# pin is valid and all other pins are blocked. If this byte is A3H (read protect is active), a Chip-Erase will be performed by internal hardware before the external host programming mode is activated. While the Chip-Erase could take TSCE (See Table 11-5) as maximum time, users may use RY/BY# pin to determine the completion of the Chip-Erase. If this byte is not A3H (not read protected), all of the flash memory are visible by using the external host programming. During the internal Program or Erase operation, the signal RY/ BY# indicates the status of the operation. When the internal Program or Erase operation is in progress, the RY/BY# will be driven low. When the internal Program or Erase operation is completed, the RY/BY# will be driven high. The device is then ready for the next operation. See Figure 11-10 for the Program Timer flowchart. Note: After writing A3H to the flash read protection register, the device needs to continue power-on prior to finishing the programming function. The programming function may include the Program-Verify function.
5-3: EXTERNAL HOST PROGRAMMING MODE PIN ASSIGNMENT
MODE0=0 MODE1=0 AD[0] AD[1] AD[2] AD[3] AD[4] AD[5] AD[6] AD[7] Input A8 Input A9 Input A10 Input A11 Input A12 Input A13 MODE0=0 MODE1=1 Input A0 Input A1 Input A2 Input A3 Input A4 Input A5 Input A6 Input A7 MODE0=1 MODE1=0 Input D0 Input D1 Input D2 Input D3 Input D4 Input D5 Input D6 Input D7 MODE0=1 MODE1=1 Output D0 Output D1 Output D2 Output D3 Output D4 Output D5 Output D6 Output D7
T5-3.1 1170
TABLE
5-4: SOFTWARE COMMAND SEQUENCE
1st Bus Write Cycle Addr1 1555H 1555H 1555H Data AAH AAH AAH 2nd Bus Write Cycle Addr1 2AAAH 2AAAH 2AAAH Data 55H 55H 55H 3rd Bus Write Cycle Addr1 1555H 1555H 1555H Data 80H 80H A0H 4th Bus Write Cycle Addr1 1555H 1555H WA3 Data AAH AAH Data
T5-4.3 1170
Command Sequence Sector-Erase Chip-Erase Byte-Program
5th Bus Write Cycle Addr1 2AAAH 2AAAH Data 55H 55H
6th Bus Write Cycle Addr1 SAX2 1555H Data 30H 10H
1. Address format A13-A0 (Hex) 2. SAX for Sector-Erase; uses A13-A7 address lines 3. WA = Program Byte address
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Remote Controller MCU SST65P542R
Data Sheet
6.0 RESET
The 65P542R can be reset from five sources: two external inputs and three internal restart conditions.
OSC Data Address
COP Watchdog Reset Illegal Address Reset
Address
Reset Control
Internal Reset
RST#
LPRST#
4064 Bus Clock Cycle Delay
1170 F16.2
FIGURE
6-1: RESET BLOCK DIAGRAM During power-up, the internal power-on reset is asserted before VDD reaches VPOR. During power-down, the internal brown-out reset is asserted after VDD drops below VBOR. (See Table 11-2)
6.1 External Reset
A low-level input on the RST# pin causes the program counter to be set to the contents of location FFFEH and FFFFH (Reset Vector). The MCU is initialized to a known state. Stack pointer will be reset to FFH. Hardware Reset is the highest priority input to the chip. An internal Schmitt trigger is implemented on the RST# input to enhance the noise immunity.
6.4 COP Watchdog Timer Reset
SST65P542R has a COP (Computer Operating Properly) watchdog timer for monitoring the proper operations of MCU. In normal operation, clearing the COP watchdog timer is executed by software within a preset period of time to avoid reaching time-out condition. To clear the COP watchdog timer, software write "0" to location 3FF0H. The COP Watchdog Reset is asserted and resets the MCU when the time-out condition occurs. The COP watchdog timer is disabled during any external reset. To enable CWT, write logical "0" to CWT control register (000DH). Refer to the SST65P542R Programming User's Manual for more information.
6.2 External Low Power Reset
The LPRST# is one of the two external sources of a reset. The signal LPRST# allows the MCU to go into low power reset mode. All clocks and oscillator to the processor are halted when the LPRST# is held low. After the LPRST# is de-asserted (driven high), a delay of 4064 bus clock cycles is automatically enabled to wait for stable crystal oscillation. This pin also implements an internal Schmitt trigger to enhance the noise immunity.
6.3 Internal Power-on and Brown-out Reset
The internal power-on and brown-out reset signal will inhibit flash Erase or Program operations during the power-on or brown-out unstable period to prevent inadvertent Writes to flash memory. The reset signal only affects flash Erase and Program operations. It will not reset other circuits of the device.
6.5 Illegal Address Reset
An illegal address reset is generated when the MCU attempts to fetch an instruction from I/O address space (0000H to 001FH). Those addresses are reserved for I/O registers only.
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Data Sheet
7.0 INTERRUPTS
SST65P542R accepts five sources of interrupts with highest to lowest priority: Software Interrupt, External Interrupts (IRQ# pin / Port B), CMT Interrupt, and Core Timer Interrupt. Whenever multiple interrupt requests are active at the same time, the higher priority one will be serviced first. All interrupts are maskable except Software Interrupt which is generated by executing SWI instruction. To mask interrupts, set the interrupt mask bit of Process Status Word (PSW). Before serving the interrupt, the MCU registers are pushed onto the stack in the sequence of PCL, PCH, IDX, ACC, PSW. The interrupt service routine should clear the source of interrupt before exiting. By executing RTI instruction, the stored MCU registers are popped from the stack and the program resumes from the interrupted location. The external interrupts, IRQ# pin and Port B interrupts are edge-sensitive and asserted on the falling edge of the pins. The Port B Interrupt Control Register enables or disables interrupts on each individual pin of port B. The External Interrupt Mask Bit (EIMSK) of Modulator Control and Status register can be used to mask all external interrupts so that lower priority interrupts such as timer interrupts can be served. The state of any external interrupt received during the masked period is preserved. When the EIMSK bit is clear, the pending interrupts activate the MCU interrupt processing again. The external interrupt causes MCU to load the contents of memory locations FFFAH and FFFBH into the Program Counter.
7.3 CMT Interrupt 7.1 Software Interrupt
The SWI instruction causes MCU to load the contents of memory locations FFFCH and FFFDH into Program Counter regardless of the interrupt mask bit in PSW register. A CMT interrupt is generated when the end of cycle flag (EOC) and the end of cycle interrupt enable (EOCIE) bits are set in the modulator control and status register (MCSR). This interrupt will vector to the interrupt service routine located at the address specified by the contents of memory locations FFF8H and FFF9H.
7.2 External Interrupts
Upon completion of the current instruction, the MCU responds to the interrupt request that is latched internally. IRQ# must be asserted (low) for at least one TILIH (125 ns). Following the completion of the current instruction, the interrupt latch is tested. If both interrupt mask bit (I bit) in the PSW is clear and the interrupt request is pending, the interrupt service routine is entered. An external resistor to VDD is required by the IRQ# input for wired-AND operation.
7.4 Core Timer Interrupt
The core timer is a 14-stage multifunctional ripple timer. User can select overflow or real-time interrupt by the setting of the Core Timer Control Status Register. Please see the timer section for more details. The timer interrupt causes MCU to load the contents of memory locations FFF6H and FFF7H into the Program Counter.
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Data Sheet
8.0 OPERATION MODES
The device can operate in two different modes. The Operation mode includes the User mode and the Learning mode. The pin definitions vary between different operation modes as described in Table 8-1.
8.2 Learning Mode
To enter the learning mode, input the IR signal to the IRQ# pin, then use the BIL and BIH instruction set to record the input signal width. For detail information on learning mode, please refer to the application note Remote Controller Learning Algorithm using SST65P542R.
8.1 User Mode
In the user mode, the embedded MCU fetches program codes from the user memory space. Please refer to the SST65P542R Programming User's Manual for instruction sets and the internal MCU programming information. TABLE
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
8-1: PIN ASSIGNMENT FOR DIFFERENT OPERATION MODES
Normal Interface Modes User Mode PB[0] PB[1] PB[2] PB[3] PB[4] PB[5] PB[6] PB[7] PA[0] PA[1] PA[2] PA[3] PA[4] PA[5] PA[6] PA[7] PC[0] PC[1] PC[2] PC[3] LPRST# VSS IRO RST# IRQ# VDD OSC2 OSC1 Learning Mode PB[0] PB[1] PB[2] PB[3] PB[4] PB[5] PB[6] PB[7] PA[0] PA[1] PA[2] PA[3] PA[4] PA[5] PA[6] PA[7] PC[0] PC[1] PC[2] PC[3] LPRST# VSS IRO RST# IRIN VDD OSC2 OSC1 AD[0] AD[1] AD[2] AD[3] AD[4] AD[5] AD[6] AD[7] PROG_RST MODE[1] SCLK RY/BY# POROUT# VIL VIL VIH WE# OE# TDIN MODE[0] LPRST# VSS TCLKIN VIL VIH VDD Do not use2 VIL
T8-1.8 1170
External Host Programming Mode1
1. See Table 5-2 for pin description. 2. OSC2 is an output, not used during external host program mode.
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Data Sheet
9.0 PERIPHERALS AND OTHERS 9.1 Core Timer
Core Timer provides the following features: 1. Real Time Interrupt (RTI) 2. Timer Overflow 3. COP watchdog timer 4. Power-on reset (POR) Please refer to SST65P542R Programming User's Manual for programming information.
9.4 Crystal/Ceramic Resonator
A crystal/ceramic oscillator circuit is shown in Figure 9-1. A ceramic resonator instead of a crystal may be used to reduce costs. It is recommended that the resonator and capacitors be mounted as close to the pins as possible to minimize output distortion. Crystal manufacturer, supply voltage, and other factors may cause circuit performance to differ from one application to another. C1 and C2 should be adjusted appropriately for each design.
9.2 Carrier Modulator Transmitter (CMT)
SST65P542R integrates a carrier modulator transmitter for supporting various encoding methods. The purpose of this module is to reduce the loading of the MCU. Three major functions are performed by this block: carrier generation, modulation, and transmission. Please refer to SST65P542R Programming User's Manual for programming information.
OSC1 30 pF 4.0 MHz 30 pF OSC2 VSS 5 M
1170 F05a.6
9.3 Clock Input Options
Control connections for the 2-lead on-chip oscillator are the OSC1 and OSC2 pins. OSC1 is input and OSC2 is output. A crystal resonator, ceramic resonator, or external clock signal can drive the oscillator.
FIGURE
9-1: USING THE CRYSTAL
EXTERNAL CLOCK SIGNAL DON'T CONNECT
OSC1
OSC2 VSS
1170 F05b.3
FIGURE
9-2: EXTERNAL CLOCK DRIVE
9.5 External Clock Drive
If external clock source is provided, OSC1 is the clock input and OSC2 is don't connect. Leave OSC2 open.
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Data Sheet
10.0 POWER SAVING MODES
SST65P542R provides two power saving modes: Stop mode and Idle mode. These two modes can be entered through the setting of the Power Saving Control Register. Refer to Section 3.1 for power saving control register. device is recovered from STOP mode. There are three conditions that will recover the device from the STOP mode: external IRQ#/Port B interrupt (EIMSK=0), RST# or external reset LPRST#. The STOP bit will be set to 1 when the device has been brought out of STOP mode. The interrupt mask bit (I bit) will not be affected.
10.1 STOP Mode
Writing a logic '0' to the STOP bit of the Power Saving Control Register enters the STOP mode. To achieve the lowest possible power consumption, the implementation uses STOP bit to gate off the internal clock. See Figure 10-1 for illustration of clock arrangement in the STOP mode. Since there is no clock input, the internal states are maintained and not changed including I/O registers and RAM memory except that the core timer counter bits are cleared. The external IRQ interrupt can brought the device out of the STOP mode, but all other interrupts are not served until the
10.2 IDLE Mode
Writing a logic '0' to the IDLE bit of the Power Saving Control Register enters the IDLE mode. In the IDLE mode, the timer is still running. Any internal or external interrupt will recover the device from IDLE mode. If both STOP and IDLE bits are '0', then STOP mode takes effect. The IDLE bit will be set to 1 when the device has been brought out of the IDLE mode. The interrupt mask bit (I bit) will not be affected.
CLK Clock Generator /2 STOP CPU Peripherals
IDLE
1170 F04.2
FIGURE
10-1: STOP MODE AND IDLE MODE
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Data Sheet
11.0 ELECTRICAL SPECIFICATION 11.1 Absolute Maximum Stress Ratings
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to +125 C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 C to + 150 C DC Voltage on Any Pin to Ground Potential. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (<20 ns) on any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V Package Power Dissipation Capability (TA = 25 C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C for 10 seconds Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
1. Excluding certain with-Pb 32-PLCC units, all packages are 260C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240C for 10 seconds; please consult the factory for the latest information. 2. Outputs shorted for no more than one second. No more than one output shorted at a time. (Based on package heat transfer limitations, not devices power consumption.)
11.2 Reliability Characteristics
TABLE 11-1: RELIABILITY CHARACTERISTICS
Symbol NEND TDR
1
Parameter Endurance Data Retention Latch Up
Minimum Specification 10,000 100 100+IDD
Units Cycles Years mA
Test Method JEDEC Standard A117 JEDEC Standard A103 JEDEC Standard 78
T11-1.3 1170
ILTH1
1. The parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
11.3 DC Specifications
TABLE 11-2: RECOMMENDED DC OPERATING CONDITIONS (TA= 0C to +70C)
Symbol VDD TA FOSC VPOR
1
Parameter Supply Voltage Temperature Osc. Frequency Power-on Reset Brown-out Reset
Min 2.2 0 0 2.0 1.9
Max 3.2 +70 8 2.2 2.1
Unit V
C
MHz V V
T11-2.2 1170
VBOR1
1. Power-on reset and Brown-out reset only affect flash Erase and Program operations. To avoid indeterministic MCU behavior and prevent inadvertent flash memory corruption, when supply voltage dips below VDD min, an external low voltage detection circuitry is required to generate reset signal to the chip. The trip point for this circuitry should be set at 2.2V5%.
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Data Sheet
11.4 DC Electrical Characteristics
TABLE 11-3: DC ELECTRICAL CHARACTERISTICS (TA = 0C to +70C, VDD = 2.2-3.2V, VSS = 0V)
Symbol IDD
1
Parameter Supply Current Run without Flash Erase/Program Operation Run with Flash Erase/Program Operation Idle2 Stop 25 0to +70
Min -
Max 8 20 2.75 6 15
Typ 2.5 10 0.8 4 9 -50 -25 -25 -12.5 VDD-0.3 VDD-0.3 VDD-0.3
Unit mA mA mA A A A A
IOZ IIN
I/O Ports Hi-Z Leakage current Port A, Port B, Port C Input Current IRQL, RESETL, LPRSTL, OSC1 Port B with Strong Pull-ups Enable (VIN = 0.2xVDD) Port B with Strong Pull-ups Enabled (VIN = 0.8xVDD) Port B with Weak Pull-ups Enable (VIN = 0.2xVDD) Port B with Weak Pull-ups Enabled (VIN = 0.8xVDD) Output Voltage -1 -34 -15 -17 -7.5 VDD-0.4 VDD-0.4 VDD-0.8 VDD-0.5 0.4 0.8 0.5 0.8 VDD 0.8 VDD VSS VSS VDD VDD 0.2 VDD 0.2 VDD 1 -74 -36 -37 -18 0.4 -10 10
VOL VOH VOH
(ILOAD = 1 mA) OSC2 (ILOAD = -500 A) OSC2 Output High Voltage (ILOAD = -1.2 mA) Port A, Port B (ILOAD = -6 mA) IRO (ILOAD = -4 mA) Port C
A
V
VOL
Output Low Voltage (ILOAD = 1.8 mA) Port A, Port B (ILOAD = 12 mA) IRO (ILOAD = 8 mA) Port C 0.2 0.3 0.3 T11-3.4 1170
V
VIH
Input High Voltage Port A, Port B, Port C, OSC1 IRQL, RESETL, LPRSTL V
VIL
Input Low Voltage Port A, Port B, Port C, OSC1 IRQL, RESETL, LPRSTL V
1. Test conditions for IDD are 8 MHz and 20 pf loading. 2. Idle current IDD is 0.4 mA typical, 0.6 mA maximum at 4 MHz, 2.2V, and 20 pf loading.
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Data Sheet
11.5 AC Electrical Characteristics
TABLE 11-4: CONTROL TIMING (TA = 0C to +70C, VDD = 2.2 to 3.2V, VSS = 0V)
Symbol FOSC FEXT FOP TCYC TOXOV1 TILCH1 TRL1 TILIH1 TOH,TOL1 Characteristic Frequency of operation Crystal External clock Internal Operating Frequency Cycle Time Crystal Oscillator Startup Time Stop Recovery Startup Time RST# Pulse Width Interrupt Pulse Width Low (Edge-Triggered) OSC1 Pulse Width 1.5 125 90 125 100 100 8 8 4 MHz MHz MHz ns ms ms TCYC ns ns
T11-4.2 1170
Min
Max
Unit
1. Guaranteed by design.
TABLE 11-5: EXTERNAL HOST PROGRAMMING-MODE TIMING PARAMETERS
Symbol TAS1 TCP
1
Parameter Address/Data Setup Time SCLK Cycle Time Address/Data Hold Time SCLK Pulse Width High Sector-Erase Time2 Chip-Erase Time2 Byte-Program Time2 TDIN Hold Time TDIN Setup Time TCLKIN Pulse Width TCLKIN Pulse Width High Reset Time Output Enable Time Address Latch Setup Time Data Latch Setup Time Read Access Time
Min 30 130 45 65
Max
Units ns ns ns ns
TAH1 TCPH1 TSE TSCE TBP TDH TDP
1
25 120 80 45 30 65 65 720 50 65 30 65
ms ms s ns ns ns ns ns ns ns ns ns
T11-5.7 1170
TDS1
1
TDPH1 TRST1 TOE1 TWES TAA1
1
TWEH1
1. Guaranteed by design. 2. Applies to IAP as well
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Data Sheet
TDP TDPH
TCLKIN (pin 23) RESET# (pin 24) LPRST# (pin 21) PROG_RST (pin 9)
TDS TRST
24 Clocks
TDH
TDIN (pin 19) RY/BY# (pin 12) POROUT# (pin 13) OSC1 (pin 8) WE#/OE# (pins 17, 18) SCLK (pin 11)
1
1
0
1
0
0
1
1 TSCE1
1. Low if Read-Protect byte is set.
1170 F06.14
FIGURE
11-1: EXTERNAL HOST PROGRAMMING MODE - SETUP CYCLE TIMING DIAGRAM
TCP TCPH SCLK (pin 11) TOE AD[7:0] (pin 8-1) TAA
XXXXX
TAS
A[13:8] TAH 0
A[7:0]
Data
Mode[1:0] (pin 10, 20) OE# (pin 18) WE# (pin 17)
XXXXX
2
3
XXXXXXXXX
1170 F07b.9
FIGURE
11-2: EXTERNAL HOST PROGRAMMING MODE - READ CYCLE TIMING DIAGRAM
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Data Sheet
TCP TCPH SCLK (pin 11)
AD[7:0] (pin 8-1) TAS Mode[1:0] (pin 10, 20)
A[13:8] TAH 0
A[7:0]
Data/Cmd TDS TDH 1
XXXXXXX XXXX XXXXXXX XXXX
TWEH
2
OE# (pin 18) WE# (pin 17)
TWES
1170 F07a.10
FIGURE
11-3: EXTERNAL HOST PROGRAMMING MODE - WRITE CYCLE TIMING DIAGRAM
Six-Byte Write Command for Chip-Erase AD[7:0] 15 55 AA 2A AA 55 15 55 80 15 55 AA 2A AA 55 15 55 10
TSCE
SCLK
Mode[1:0]
0
2
1
0
2
1
0
2
1
0
2
1
0
2
1
0
2
1
WE# RY/BY#
1170 F08.10
FIGURE
11-4: EXTERNAL HOST PROGRAMMING MODE - CHIP-ERASE TIMING DIAGRAM
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Remote Controller MCU SST65P542R
Data Sheet
Six-Byte Write Command for Sector-Erase AD[7:0] 15 55 AA 2A AA 55 15 55 80 15 55 AA 2A AA 55 SAH SAL 30
TSE
SCLK
Mode[1:0]
0
2
1
0
2
1
0
2
1
0
2
1
0
2
1
0
2
1
WE# RY/BY# Note: SAH and SAL = Sector Address, A14-A7 are used
1170 F09.10
FIGURE
11-5: EXTERNAL HOST PROGRAMMING MODE SECTOR-ERASE TIMING DIAGRAM
Four-Byte Write Command for Byte-Program AD[7:0] 15 55 AA 2A AA 55 15 55 A0 BAH BAL Data
TBP
SCLK
Mode[1:0]
0
2
1
0
2
1
0
2
1
0
2
1
WE# RY/BY# Note: BAH BAL = Byte Address, A13-A0 are used
1170 F10.9
FIGURE
11-6: EXTERNAL HOST PROGRAMMING MODE BYTE-PROGRAM TIMING DIAGRAM
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Data Sheet
VIHT
INPUT
VIT
REFERENCE POINTS
VOT
OUTPUT
VILT
1170 F14.0
AC test inputs are driven at VIHT (0.9 VDD) for a logic "1" and VILT (0.1 VDD) for a logic "0". Measurement reference points for inputs and outputs are at VIT (0.5 VDD) and VOT (0.5 VDD) Input rise and fall times (10% 90%) are <5 ns.
Note: VHT - VHIGH Test VLT - VLOW Test VIHT - VINPUT HIGH Test VILT - VINPUT LOW Test
FIGURE
11-7: AC INPUT/OUTPUT REFERENCE WAVEFORM
TO TESTER
TO DUT CL
1170 F15.0
FIGURE
11-8: A TEST LOAD EXAMPLE
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Data Sheet
Start
Write data: AAH Address: 1555H
Write data: 55H Address: 2AAAH
Write data: A0H Address: 1555H
Write Address Data
Wait for end of Program (TBP, RY/BY#)
Program Completed
1170 F11.6
FIGURE
11-9: BYTE-PROGRAM COMMAND SEQUENCE FOR EXTERNAL HOST PROGRAMMING MODE
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
36
Remote Controller MCU SST65P542R
Data Sheet
Program Timer Program/Erase Initiated
RY/BY# Polling Program/Erase Initiated
Wait TBP, TSCE, or TSE
RY/BY#
No Program/Erase Completed
RY/BY# = High Yes
Program/Erase Completed
1170 F12.3
FIGURE 11-10: WAIT OPTIONS FOR EXTERNAL HOST PROGRAMMING MODE
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
37
Remote Controller MCU SST65P542R
Data Sheet
Chip-Erase Command Sequence Load data: AAH Address: 1555H
Sector-Erase Command Sequence Load data: AAH Address: 1555H
Load data: 55H Address: 2AAAH
Load data: 55H Address: 2AAAH
Load data: 80H Address: 1555H
Load data: 80H Address: 1555H
Load data: AAH Address: 1555H
Load data: AAH Address: 1555H
Load data: 55H Address: 2AAAH
Load data: 55H Address: 2AAAH
Load data: 10H Address: 1555H
Load data: 30H Address: SAX
Wait for End-of-Erase (TSCE, RY/BY#)
Wait for End-of-Erase (TSE, RY/BY#)
Chip erased to FFFFH
Sector erased to FFFFH
1170 F13.7
FIGURE 11-11: CHIP-/SECTOR-ERASE COMMAND SEQUENCE FOR EXTERNAL HOST PROGRAMMING MODE
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
38
Remote Controller MCU SST65P542R
Data Sheet
12.0 PRODUCT ORDERING INFORMATION
SST65 SSTXX P X 54 XX 2 X R -8 X -X C X - SG - XX E X Environmental Attribute E1 = non-Pb Package Modifier G = 28 leads Package Type S = SOIC Operation Temperature C = Commercial: 0C to +70C Operating Frequency 8 = 8.0 MHz Function R = Remote Controller On-Chip SRAM Size 2 = 352 Bytes Flash Memory Size 4 = 16 KByte Core Sub-Block 5 = Enhanced 6502 core Voltage 2.2- 3.2V Product Series
1. Environmental suffix "E" denotes non-Pb solder. SST non-Pb solder devices are "RoHS Compliant".
12.1 Valid Combinations
Valid combinations for SST65P542R SST65P542R-8-C-SG SST65P542R-8-C-SGE
Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations.
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
7/05
39
Remote Controller MCU SST65P542R
Data Sheet
13.0 PACKAGING DIAGRAMS
7.40 7.60
10.01 10.64
Pin #1 Identifier
17.70 18.10 2.36 2.64 .33 .51 .10 .30 .23 .30 0.4 1.27
1.27 BSC
Note:
1. Complies with JEDEC publication 95 MS-013 AE dimensions, although some dimensions may be more stringent. 2. All linear dimensions are in millimeters (min/max). 3. Coplanarity: 0.1 (.05) mm. 4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
28-soic-SG-5
28-LEAD SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) SST PACKAGE CODE: SG
(c)2005 Silicon Storage Technology, Inc.
S71170-06-000
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Remote Controller MCU SST65P542R
Data Sheet TABLE 13-1: REVISION HISTORY
Number 01 02 03 Description Date Nov 2000 Mar 2001 Dec 2001
* * * * * * * * * * * * * * *
Initial release Corrected "Memory Map" on page 7 Clarified Section "Flash Read Protection" on page 23 Corrected footnotes in Table 3-1 on page 8 Corrected IDD values in Table 11-3 on page 30 Corrected TOE values in Table 11-5 on page 31 Change document status to "Data Sheet" Corrected IOZ values in Table 11-3 on page 30 Clarified Section "Internal Power-on and Brown-out Reset" on page 24 Expanded Table 11-2 on page 29 Added Revision History table Clarified Reset bullet under features on page 1 Updated footnote in Table 11-2 on page 29 Added RoHS compliance information on page 1 and in the "Valid combinations for SST65P542R" on page 39 Updated the surface mount lead temperature from 240C to 260C and the time from 3 seconds to 10 seconds on page 29.
04 05
Feb 2002 May 2003
06
Jul 2005
Silicon Storage Technology, Inc. * 1171 Sonora Court * Sunnyvale, CA 94086 * Telephone 408-735-9110 * Fax 408-735-9036 www.SuperFlash.com or www.sst.com
(c)2005 Silicon Storage Technology, Inc. S71170-06-000 7/05
41


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